RTL to GDSII: A Complete Guide to End-to-End VLSI Design Execution

June 4, 2025
VLSI services

In the world of semiconductor design, RTL to GDSII represents the full lifecycle of transforming a high-level logic description into a physically manufacturable layout. For product companies and fabless startups alike, understanding this process—and having a reliable design services partner—is crucial to achieving first-pass silicon success.

In this guide, we’ll break down the RTL-to-GDSII process step-by-step, explain where outsourcing adds value, and how Nsemi Design ensures quality across the entire flow.

What is RTL to GDSII?

RTL to GDSII” refers to the back-end VLSI design flow starting from Register Transfer Level (RTL) code (typically in Verilog or VHDL) and ending with the GDSII file used for chip fabrication.

This process includes:
✅ Synthesis
✅ Design for Test (DFT)
✅ Floorplanning
✅ Placement & Clock Tree Synthesis (CTS)
✅ Routing
✅ Static Timing Analysis (STA)
✅ Signoff (LVS, DRC, IR/EM, etc.)

👉 Also Read: VLSI Design Services – What They Are and How to Choose the Right Partner

Key Stages in the RTL to GDSII Flow

1. RTL Handoff and Synthesis

  • Input: Clean, synthesizable RTL
  • Goal: Convert RTL into a gate-level netlist
  • Tools Used: Design Compiler, Genus, Yosys

2. Design for Test (DFT)

  • Scan insertion
  • Boundary scan, MBIST
  • Fault coverage reports

💡 A strong DFT strategy helps avoid costly silicon respins.

3. Floorplanning and Power Planning

  • Macro/block placement
  • IO planning and pin assignment
  • Power grid definition

4. Placement & Clock Tree Synthesis

  • Standard cell placement
  • CTS to ensure minimal clock skew
  • Early congestion analysis

5. Routing

  • Global and detailed routing
  • Crosstalk, antenna, and signal integrity checks

👉 Dive Deeper: Physical Design in VLSI – Key Steps and Challenges

6. Timing Closure (STA)

  • Worst-case path analysis
  • Setup/hold violation fixes
  • Multi-mode multi-corner (MMMC) optimization

7. Physical Verification and Signoff

  • DRC, LVS (Layout vs Schematic)
  • IR drop and Electromigration (EM)
  • Tape-out-ready GDSII file generation

Where Outsourcing Makes Sense

Handling RTL to GDSII in-house requires large teams and costly tool licenses. Outsourcing to a service company like Nsemi Design gives you:

  • Access to EDA tools without added investment
  • Expert engineers who’ve done multiple successful tape-outs
  • Scalability during crunch time
  • Reduced time-to-market

Case Study Highlight: From RTL to GDSII in 10 Weeks

(Insert a real-life anonymized project where Nsemi handled RTL-to-GDSII for a client, saved 30% time, met PPA goals, and passed all foundry checks on the first attempt.)

Best Practices for Successful RTL to GDSII Projects

  • Clean, lint-free RTL as input
  • Defined timing, power, and area (PPA) constraints
  • Early floorplan reviews with physical-aware design
  • Regular design reviews with the client
  • Formal verification between RTL and netlist

Why Choose Nsemi Design for RTL to GDSII

At Nsemi, our RTL to GDSII offering includes:

✅ Full toolchain support (Cadence, Synopsys, Mentor)
✅ Engineering teams with 7nm to 65nm experience
✅ Strong documentation, progress tracking, and client communication
✅ Flexible engagement models (project-based, hourly, ODC)

Related Blogs to Explore

Let’s Build Your Next Chip

Ready to start your next ASIC or SoC project?
✅ Contact Nsemi Design today for a customized RTL to GDSII execution proposal.

🔗 Visit: nsemidesign.com


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